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Joints Soldered on Electroless Ni–Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement
Kumamoto, Seishi, Sakurai, Hitoshi, Ikeda, Kazuki, Suganuma, KatsuakiVolume:
46
Year:
2005
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.46.2380
File:
PDF, 266 KB
english, 2005