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The Simulation of Shape Evolution of Solder Joints during Reflow Process and Its Experimental Validation
Chou, Ya-Yun, Chang, Hung-Ju, Kuo, Jer-Haur, Hwang, Weng-SingVolume:
47
Year:
2006
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.47.1186
File:
PDF, 243 KB
english, 2006