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Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand
Okumura, Tomohiro, Saitoh, Mitsuo, Nishikawa, Kazutaka, Furusawa, Akio, Suetsugu, KenichiroVolume:
47
Year:
2006
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.47.941
File:
PDF, 306 KB
english, 2006