Pressureless Bonding by Micro-Sized Silver Particle Paste...

MATERIALS TRANSACTIONS 2016 Vol. 57; Iss. 7

Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging

Roh, Myong-Hoon, Nishikawa, Hiroshi, Tsutsumi, Seiichiro, Nishiwaki, Naruhiko, Ito, Keiichi, Ishikawa, Koji, Katsuya, Akihiro, Kamada, Nobuo, Saito, Mutsuo
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Volume:
57
Year:
2016
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.md201513
File:
PDF, 12.11 MB
english, 2016
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