Strength and HRTEM microstructure at bond interface of aluminum/copper clad materials
Yamaguchi, Tomiko, Xie, Wei, Era, Hidenori, Nishio, KazumasaVolume:
59
Year:
2009
Language:
english
Journal:
Journal of Japan Institute of Light Metals
DOI:
10.2464/jilm.59.542
File:
PDF, 4.04 MB
english, 2009