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Photosensitive polyimide application for multi-chip packages.
Inoue, Tatsuo, Seino, Ken, Tamura, Koetsu, Hasegawa, Shin-ichi, Kimbara, KohjiVolume:
5
Year:
1992
Language:
english
Journal:
Journal of Photopolymer Science and Technology
DOI:
10.2494/photopolymer.5.385
File:
PDF, 404 KB
english, 1992