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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - 3D integrated eWLB /FO-WLP technology for PoP & SiP
Lin, Yaojian, Kang, Chen, Chua, Linda, Choi, Won Kyung, Yoon, Seung WookYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583199
File:
PDF, 1.70 MB
english, 2016