[IEEE 2016 17th International Conference on Electronic...

  • Main
  • [IEEE 2016 17th International...

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - 3D integrated eWLB /FO-WLP technology for PoP & SiP

Lin, Yaojian, Kang, Chen, Chua, Linda, Choi, Won Kyung, Yoon, Seung Wook
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2016
Language:
english
DOI:
10.1109/icept.2016.7583199
File:
PDF, 1.70 MB
english, 2016
Conversion to is in progress
Conversion to is failed