Influence of Lattice Defects Introduced in Copper during...

Journal of the Japan Institute of Metals 2006 Vol. 70; Iss. 7

Influence of Lattice Defects Introduced in Copper during Electroplating on the Interlayer Reaction to Sn-3.0Ag-0.5Cu Lead Free Solder

Shishido, Itsuroh, Matsuo, Akihiko, Toyoyama, Hirokazu, Mizuno, Masataka, Araki, Hideki, Shirai, Yasuharu
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Volume:
70
Year:
2006
Journal:
Journal of the Japan Institute of Metals
DOI:
10.2320/jinstmet.70.548
File:
PDF, 427 KB
2006
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