Interface Structure of Cu Wire Bonding on Cu Substrate with...

Journal of the Japan Institute of Metals 2014 Vol. 78; Iss. 5

Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating

Fujiwara, Shinichi, Dauskardt, Reinhold H.
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Volume:
78
Year:
2014
Language:
english
Journal:
Journal of the Japan Institute of Metals and Materials
DOI:
10.2320/jinstmet.j2013075
File:
PDF, 6.10 MB
english, 2014
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