Evolution of Grain and Micro-Void Structure in...

MATERIALS TRANSACTIONS 2002 Vol. 43; Iss. 7

Evolution of Grain and Micro-Void Structure in Electroplated Copper Interconnects

Hobbs, Anthony, Murakami, Satoshi, Hosoda, Tsotomi, Ohtsuka, Satoshi, Miyajima, Motoshu, Sugatani, Shinji, Nakamura, Tomoji
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Volume:
43
Year:
2002
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.43.1629
File:
PDF, 87 KB
english, 2002
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