Influence of Soldering Conditions on Void Formation in Large-area Solder Joints
Onuki, Jin, Chonan, Yasunori, Komiyama, Takao, Nihei, MasayasuVolume:
43
Year:
2002
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.43.1774
File:
PDF, 90 KB
english, 2002