Electrodeposition of a Copper-Tellurium Compound under Diffusion-Limiting Control
Ishizaki, Takahiro, Yata, Daisuke, Fuwa, AkioVolume:
44
Year:
2003
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.44.1583
File:
PDF, 226 KB
english, 2003