Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
Kariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, Tanaka, MasamotoVolume:
45
Year:
2004
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.45.689
File:
PDF, 471 KB
english, 2004