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Microstructural Evolution of Joint Interface between Eutectic 80Au–20Sn Solder and UBM
Kim, Sung Soo, Kim, Jong Hoon, Booh, Seong Woon, Kim, Tae-Gyu, Lee, Hyuck MoVolume:
46
Year:
2005
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.46.2400
File:
PDF, 315 KB
english, 2005