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Solid State Bonding of Carbon Material to Copper with Nickel Insert
Sueyoshi, Hidekazu, Fukudome, HisayoshiVolume:
49
Year:
2008
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.h-mra2008819
File:
PDF, 177 KB
english, 2008