Effects of Si on Electromigration Resistance and Interfacial Reaction in Bilayered Al–0.5Cu–1Si/TiW Interconnections
Onuki, Jin, Koike, Yoshihiko, Koubuchi, Yasushi, Tanigaki, YukioVolume:
33
Year:
1992
Journal:
Materials Transactions, JIM
DOI:
10.2320/matertrans1989.33.410
File:
PDF, 1.32 MB
1992