Improvement in Step Coverage at Submicron Contact Holes by...

Improvement in Step Coverage at Submicron Contact Holes by Switching Bias Sputtering

Onuki, Jin, Nihei, Masayasu
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Volume:
36
Year:
1995
Journal:
Materials Transactions, JIM
DOI:
10.2320/matertrans1989.36.670
File:
PDF, 919 KB
1995
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