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Low-cost bump-bonding processes for high energy physics pixel detectors
Caselle, M., Blank, T., Colombo, F., Dierlamm, A., Husemann, U., Kudella, S., Weber, M.Volume:
11
Language:
english
Journal:
Journal of Instrumentation
DOI:
10.1088/1748-0221/11/01/C01050
Date:
January, 2016
File:
PDF, 3.84 MB
english, 2016