Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
Sasajima, Yasushi, Satoh, Takatoshi, Tamahashi, Kunihiro, Onuki, JinVolume:
53
Year:
2012
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.m2012069
File:
PDF, 4.70 MB
english, 2012