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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - A New Reliable Adhesion Enhancement Process for Directly Plating on Molding Compounds for Package Level EMI Shielding
Mukai, Kenichiroh, Eastep, Brian, Kim, Kwonil, Gaherty, Lee, Kashyap, AnirudhYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.375
File:
PDF, 1.83 MB
english, 2016