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[IEEE 2016 5th International Symposium on Next-Generation Electronics (ISNE) - Hsinchu, Taiwan (2016.5.4-2016.5.6)] 2016 5th International Symposium on Next-Generation Electronics (ISNE) - The defect reduction of Cu interconnects by optimized Cu seed layer
Liu, Shi-Jun, Wang, Wei-Lin, Yen, Yue-Yin, Hsu, Chan-Hao, Chien, Hung-Ju, Peng, Kuo-Tzu, Yeh, Ming-Hsin, Kuo, Hsien-Chang, Ying, Tzung-HuaYear:
2016
Language:
english
DOI:
10.1109/isne.2016.7543278
File:
PDF, 2.67 MB
english, 2016