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Effect of Added Elements on Microstructures and Joint Strength of Lead-Free Sn-Based Solder Joint Dispersed IMC Pillar
Hayashi, Yawara, Shohji, Ikuo, Nakata, Yusuke, Hashimoto, TomihitoVolume:
879
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.879.2216
Date:
November, 2016
File:
PDF, 1.31 MB
english, 2016