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[IEEE 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Oradea, Romania (2016.10.20-2016.10.23)] 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME) - A study of SW150 conductive paste as a possible use in solderless assembly for electronics
Varzaru, G., Marghescu, C., Vasile, Alex., Svasta, P., Buta, B.Year:
2016
Language:
english
DOI:
10.1109/SIITME.2016.7777237
File:
PDF, 477 KB
english, 2016