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[IEEE 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Oradea, Romania (2016.10.20-2016.10.23)] 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Thermophysical properties of some Low Temperature Lead-Free solder pastes dedicated to automotive applications
Branzei, M., Plotog, I., Varzaru, G., Cucu, T. C.Year:
2016
Language:
english
DOI:
10.1109/SIITME.2016.7777240
File:
PDF, 405 KB
english, 2016