[IEEE 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Oradea, Romania (2016.10.20-2016.10.23)] 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME) - Thermophysical properties of some Low Temperature Lead-Free solder pastes dedicated to automotive applications

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