[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - 2D Grating Pitch Mapping of a through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction: IEEE Electronic Components and Technology Conference, 2016
Houghton, Todd, Saxon, Michael, Song, Zeming, Nyugen, Hoa, Jiang, Hanqing, Yu, HongbinYear:
2016
DOI:
10.1109/ectc.2016.309
File:
PDF, 4.28 MB
2016