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[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Improved performance of flexible CMOS technology using ultimate thinning and transfer bonding
Dubois, E., Philippe, J., Berthome, M., Robillard, J.F., Gaquiere, C., Danneville, F., Gloria, D., Raynaud, C.Year:
2016
Language:
english
DOI:
10.1109/ESTC.2016.7764513
File:
PDF, 19.84 MB
english, 2016