Solder material experiencing low temperature inelastic stress and random vibration loading: predicted remaining useful lifetime
Suhir, E., Ghaffarian, R., Yi, S.Volume:
28
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-5960-9
Date:
February, 2017
File:
PDF, 472 KB
english, 2017