[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Ultra-Fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process
Kim, Soon-Wook, Detalle, Mikael, Peng, Lan, Nolmans, Philip, Heylen, Nancy, Velenis, Dimitrios, Miller, Andy, Beyer, Gerald, Beyne, EricYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.205
File:
PDF, 926 KB
english, 2016