The variation of grain structure and the enhancement of...

The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

Fleshman, Collin, Chen, Wei-Yu, Chou, Tzu-Ting, Huang, Jia-Hong, Duh, Jenq-Gong
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Volume:
189
Language:
english
Journal:
Materials Chemistry and Physics
DOI:
10.1016/j.matchemphys.2016.12.013
Date:
March, 2017
File:
PDF, 1.67 MB
english, 2017
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