[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-Integrated Micro Heater and Thermocouple
Guan, Yong, Zhu, Yunhui, Ma, Shenglin, Zeng, Qinghua, Bian, Yuan, Zhong, Xiao, Chen, Jing, Jin, YufengYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.44
File:
PDF, 396 KB
english, 2016