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[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - III–V/Si Chip-on-Wafer Direct Transfer Bonding technology (CoW DTB); process capabilities and bonded structure characterizations
Kurita, Yoichiro, Uemura, Hiroshi, Ishibashi, Fumitaka, Furuyama, Hideto, Inamura, Miki, Kakumoto, Yasuhide, Abe, TomoyukiYear:
2016
Language:
english
DOI:
10.1109/ESTC.2016.7764692
File:
PDF, 1.45 MB
english, 2016