![](/img/cover-not-exists.png)
[IEEE 2016 IEEE International Reliability Physics Symposium (IRPS) - Pasadena, CA, USA (2016.4.17-2016.4.21)] 2016 IEEE International Reliability Physics Symposium (IRPS) - Impact of wafer thinning on front-end reliability for 3D integration
Chasin, Adrian, Scholz, Mirko, Guo, Wei, Franco, Jacopo, Potoms, Goedele, Jourdain, Anne, Linten, Dimitri, Van der Plas, Geert, Absil, Philippe, Beyne, EricYear:
2016
Language:
english
DOI:
10.1109/irps.2016.7574562
File:
PDF, 993 KB
english, 2016