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Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints
Li, Z.L., Cheng, L.X., Li, G.Y., Huang, J.H., Tang, Y.Volume:
697
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2016.12.131
Date:
March, 2017
File:
PDF, 874 KB
english, 2017