[IEEE 2016 IEEE 66th Electronic Components and Technology...

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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Scalable Modeling and Measurement of TSV Applied for Efficiency Improvement of a RF PA

Jhong, Ming-Fong, Ho, Cheng-Yu, Pan, Po-Chih, Cheng, Hung-Hsiang, Hsieh, Sheng-Chi, Wang, Chen-Chao, Hwang, Lih-Tyng
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Year:
2016
Language:
english
DOI:
10.1109/ectc.2016.86
File:
PDF, 723 KB
english, 2016
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