![](/img/cover-not-exists.png)
[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Scalable Modeling and Measurement of TSV Applied for Efficiency Improvement of a RF PA
Jhong, Ming-Fong, Ho, Cheng-Yu, Pan, Po-Chih, Cheng, Hung-Hsiang, Hsieh, Sheng-Chi, Wang, Chen-Chao, Hwang, Lih-TyngYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.86
File:
PDF, 723 KB
english, 2016