[IEEE 2013 IEEE Hot Chips 25 Symposium (HCS) - Stanford, CA (2013.8.25-2013.8.27)] 2013 IEEE Hot Chips 25 Symposium (HCS) - A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface
Miura, Noriyuki, Koizumi, Yusuke, Sasaki, Eiichi, Take, Yasuhiro, Matsutani, Hiroki, Kuroda, Tadahiro, Amano, Hideharu, Sakamoto, Ryuichi, Namiki, Mitaro, Usami, Kimiyoshi, Kondo, Masaaki, Nakamura, HYear:
2013
Language:
english
DOI:
10.1109/hotchips.2013.7478328
File:
PDF, 15.17 MB
english, 2013