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[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Development of fine pitch interconnections for 3D integrated circuits
Bana, F., Garnier, A., Bresson, N., Ponthenier, F., Loiodice, P., Casset, F., Jouve, A., Lattard, D., Cheramy, S.Year:
2016
Language:
english
DOI:
10.1109/ESTC.2016.7764468
File:
PDF, 901 KB
english, 2016