X-ray inspection of TSV defects with self-organizing map...

Microelectronics Reliability 2016 / 12 Vol. 67

X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm

Shen, Junjie, Chen, Pengfei, Su, Lei, Shi, Tielin, Tang, Zirong, Liao, Guanglan
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Volume:
67
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.10.011
Date:
December, 2016
File:
PDF, 1.34 MB
english, 2016
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