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The effect of micro via‐in pad designs on surface‐mount assembly defects: part I – tombstoning
Lee, Yong‐Won, Kim, Keun‐Soo, Suganuma, KatsuakiVolume:
24
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911211240065
Date:
June, 2012
File:
PDF, 479 KB
english, 2012