Solder joint degradation and detection using RF impedance...

Solder joint degradation and detection using RF impedance analysis

Bin, Yao, Yudong, Lu, Ming, Wan
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Volume:
25
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911311294579
Date:
February, 2013
File:
PDF, 347 KB
english, 2013
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