Direct bonding of silicon with solders type Sn-Ag-Ti

Soldering & Surface Mount Technology 2016 / 06 Vol. 28; Iss. 3

Direct bonding of silicon with solders type Sn-Ag-Ti

Kolenak, Roman, Kostolný, Igor, Sahul, Martin
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Volume:
28
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-11-2015-0040
Date:
June, 2016
File:
PDF, 572 KB
english, 2016
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