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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Board-Level Reliability of 3D through Glass via Filters During Thermal Cycling
McCann, Scott, Kuramochi, Satoru, Yun, Hobie, Sundaram, Venkatesh, Pulugurtha, M. Raj, Tummala, Rao R., Sitaraman, Suresh K.Year:
2016
Language:
english
DOI:
10.1109/ectc.2016.362
File:
PDF, 509 KB
english, 2016