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[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Ultra-thin PoP solution using wafer level Fan-out technologies
Chueh An Hsieh,, Chung Hsuan Tsai,Year:
2016
Language:
english
DOI:
10.1109/estc.2016.7764478
File:
PDF, 11.65 MB
english, 2016