Copper Pulse-Reverse Current Electrodeposition to Fill...

IEEE Transactions on Components Packaging and Manufacturing Technology 2016 / 12 Vol. 6; Iss. 12

Copper Pulse-Reverse Current Electrodeposition to Fill Blind Vias for 3-D TSV Integration

Tian, Qing, Cai, Jian, Zheng, Jingan, Zhou, Can, Li, Junhui, Zhu, Wenhui
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Volume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2621759
Date:
December, 2016
File:
PDF, 1.56 MB
english, 2016
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