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Copper Pulse-Reverse Current Electrodeposition to Fill Blind Vias for 3-D TSV Integration
Tian, Qing, Cai, Jian, Zheng, Jingan, Zhou, Can, Li, Junhui, Zhu, WenhuiVolume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2621759
Date:
December, 2016
File:
PDF, 1.56 MB
english, 2016