[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Merging of packaging technologies for highly integrated embedded modules
Schwarz, Timo, Stahr, Hannes, Cardoso, Andre, Fernandes, Elisabete, Des Etangs-Levallois, Aurelien Lecavelier, Brizoux, MichelYear:
2016
Language:
english
DOI:
10.1109/estc.2016.7764464
File:
PDF, 46.32 MB
english, 2016