Effective 3-D Device Electrothermal Simulation Analysis of...

IEEE Transactions on Electron Devices 2017 / 1 Vol. 64; Iss. 1

Effective 3-D Device Electrothermal Simulation Analysis of Influence of Metallization Geometry on Multifinger Power HEMTs Properties

Chvala, Ales, Marek, Juraj, Pribytny, Patrik, Satka, Alexander, Donoval, Martin, Donoval, Daniel
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Volume:
64
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/ted.2016.2629024
Date:
January, 2017
File:
PDF, 1011 KB
english, 2017
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