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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Low melting alloy composites as thermal interface materials with low thermal resistance
Wen, Haoran, Ji, Yaqiang, Zhang, Kai, Yuen, Matthew M.F., Lee, S.W. Ricky, Fu, Xian-Zhu, Sun, Rong, Wong, Ching-PingYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583147
File:
PDF, 553 KB
english, 2016