[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Demonstration of Next-Generation Au-Pd Surface Finish with Solder-Capped Cu Pillars for Ultra-Fine Pitch Applications
Huang, Ting-Chia, Smet, Vanessa, Raj, Pulugurtha Markondeya, Tummala, Rao R., Ramos, Gustavo, Kilian, Arnd, Taylor, Robin, Nichols, RickYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.331
File:
PDF, 1.07 MB
english, 2016