![](/img/cover-not-exists.png)
[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Board level reliability improvement in eWLB (embedded wafer level BGA) packages
Chow, Seng Guan, Lin, Yaojian, Adams, Bernard, Yoon, Seung WookYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7799978
File:
PDF, 5.75 MB
english, 2016