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Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn∕37Pb and Sn∕3Ag∕0.5Cu Solder Alloys
Sasaki, Katsuhiko, Kobayashi, Takuji, Ohguchi, Ken-ichiVolume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429714
File:
PDF, 194 KB
english, 2007