[IEEE 2016 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2016.11.7-2016.11.9)] 2016 IEEE CPMT Symposium Japan (ICSJ) - Moisture induced interface delamination for EMI shielding package
Liu, Yangming, Ji, Zhongli, Chen, Peng, Wang, Xu, Ye, Ning, Chiu, Chin-TienYear:
2016
Language:
english
DOI:
10.1109/ICSJ.2016.7801264
File:
PDF, 1.15 MB
english, 2016